PART |
Description |
Maker |
15-44-5172 |
2.54mm (.100) Pitch C-Grid? Receptacle, Through Hole, Dual Row 2.54mm (.100") Pitch C-Grid垄莽 Receptacle, Through Hole, Dual Row
|
Molex Electronics Ltd.
|
0015910540 015-91-0540 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0015910580 015-91-0580 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 58 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0015910360 015-91-0360 71308-0136N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 36 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0015910120 015-91-0120 71308-0112N |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 12 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating MOLEX Connector
|
Molex Electronics Ltd.
|
0918143118 91814-3118 |
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header 2.54mm (.100) Pitch C-Grid III?/a> Dual Row Right Angle Shrouded Header 2.54mm (.100") Pitch C-Grid III垄芒 Dual Row Right Angle Shrouded Header
|
Molex Electronics Ltd.
|
D9224-46 D9924-46 D9224-01 D9724-46 D9240-46 D9922 |
2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin, 24-way DIP24, IC SOCKET 2.54mm Pitch Dual Row Vertical Through Connect Header Assembly, tin (hi-temp mould), 40-way DIP40, IC SOCKET DIP22, IC SOCKET
|
Harwin PLC HARWIN INC
|
0901512234 90151-2234 |
2.54mm (.100) Pitch C-Grid III PC Board Connector, Dual Row, Vertical, 34 Circuits 2.54mm (.100) Pitch C-Grid III垄芒 PC Board Connector, Dual Row, Vertical, 34 Circuits
|
Molex Electronics Ltd.
|
0901512210 90151-2210 |
2.54mm (.100) Pitch C-Grid III PC Board Connector, Dual Row, Vertical, 10 Circuits 2.54mm (.100) Pitch C-Grid III垄芒 PC Board Connector, Dual Row, Vertical, 10 Circuits
|
Molex Electronics Ltd.
|
0901512214 90151-2214 |
2.54mm (.100) Pitch C-Grid III PC Board Connector, Dual Row, Vertical, 14 Circuits 2.54mm (.100) Pitch C-Grid III垄芒 PC Board Connector, Dual Row, Vertical, 14 Circuits
|
Molex Electronics Ltd.
|
0015910680 015-91-0680 |
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Surface Mount, Dual Row, Vertical, 68 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
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